Título:
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Full composition range silicon oxynitride films deposited by ECR-PECVD at room temperature
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Autores:
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Mártil de la Plaza, Ignacio ;
González Díaz, Germán ;
Prado Millán, Álvaro del
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Tipo de documento:
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texto impreso
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Editorial:
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Elsevier Science SA, 1999-04
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Dimensiones:
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application/pdf
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Nota general:
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info:eu-repo/semantics/openAccess
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Idiomas:
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Palabras clave:
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Estado = Publicado
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Materia = Ciencias: Física: Electricidad
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Materia = Ciencias: Física: Electrónica
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Tipo = Artículo
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Resumen:
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Silicon oxynitride films were deposited at room temperature using the ECR-PECVD technique. Precursor gases were O(2), N(2) and SiH(4). The composition of the films can be controlled by regulating the gases flow ratio. R = (O(2) + N(2))/SiH(4) and R' = O(2)/SiH(4) have proved to be the key deposition parameters. FTIR spectroscopy, AES and ellipsometric measurements were performed in order to characterise the films. A single Si-O/Si-N stretching band is observed in the FTIR spectrum for all compositions, indicating single-phase homogeneous SiO(x)N(y) films. FWHM of the stretching band shows a maximum for the composition corresponding to the same number of Si-O and Si-N bonds. Samples cover the whole composition range from silicon nitride to silicon oxide including nitrogen-rich films, even though the gas flow ratio R " = N(2)/O(2) during deposition was small (from R " = 1.0 for SiO(1.9)N(0.04) to R " I = 6.7 for SiO(0.26)N(1.2)). Silicon oxide composition samples (SiO(2.0)) show essentially the same TR features as the thermal oxide: Si-O stretching band located at 1072 cm(-1), with a FWHM of 96 cm(-1) and a shoulder/peak ratio of 0.30, while nitrogen-rich samples (SiO(0.26)N(1.2)) show a total bonded hydrogen content below 2 x 10(22) cm(-3).
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En línea:
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https://eprints.ucm.es/id/eprint/27014/1/Martil%2C90.pdf
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