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Título:
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A comparative study of the electrical properties of TiO2 films grown by high-pressure reactive sputtering and atomic layer deposition
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Autores:
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Mártil de la Plaza, Ignacio ;
González Díaz, Germán ;
San Andres Serrano, Enrique
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Tipo de documento:
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texto impreso
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Editorial:
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IOP publishing ltd, 2005-10
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Dimensiones:
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application/pdf
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Nota general:
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info:eu-repo/semantics/openAccess
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Idiomas:
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Palabras clave:
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Estado = Publicado
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Materia = Ciencias: Física: Electricidad
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Materia = Ciencias: Física: Electrónica
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Tipo = Artículo
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Resumen:
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Oxide-semiconductor interface quality of high-pressure reactive sputtered (HPRS) TiO2 films annealed in O-2 at temperatures ranging from 600 to 900 degrees C, and atomic layer deposited (ALD) TiO2 films grown at 225 or 275 degrees C from TiCl4 or Ti(OC2H5)(4), and annealed at 750 degrees C in O-2, has been studied on silicon substrates. Our attention has been focused on the interfacial state and disordered-induced gap state densities. From our results, HPRS films annealed at 900 degrees C in oxygen atmosphere exhibit the best characteristics, with D-it density being the lowest value measured in this work (5-6 x 10(11) cm(-2) eV(-1)), and undetectable conductance transients within our experimental limits. This result can be due to two contributions: the increase of the SiO2 film thickness and the crystallinity, since in the films annealed at 900 degrees C rutile is the dominant crystalline phase, as revealed by transmission electron microscopy and infrared spectroscopy. In the case of annealing in the range of 600-800 degrees C, anatase and rutile phases coexist. Disorder-induced gap state (DIGS) density is greater for 700 degrees C annealed HPRS films than for 750 degrees C annealed ALD TiO2 films, whereas 800 degrees C annealing offers DIGS density values similar to ALD cases. For ALD films, the studies clearly reveal the dependence of trap densities on the chemical route used.
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En línea:
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https://eprints.ucm.es/id/eprint/26017/1/Martil%2C38.pdf
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